Telecom PCBs
In Telecom industry, PCB is mainly used in wireless network, transmission network, data communication and fixed-line broadband area, Backplane PCBs, high-speed multilayer PCBs , High-frequency microwave PCBs are major application used on base station, OTN transmission, routers, switches, servers, OLT, ONU and other equipment. Compared with other industries, Telecom PCBs are mostly high-speed PCBs and high-frequency PCBs. To meet the requirements on capacity and speed, in service/storage field, the proportion of 8 layers and above PCBs accounted for as high as 33%, and in the field of Telecom equipment, the proportion of 8 layers and above PCBs accounted for more than 42%, which is much higher than other subdivisions. Besides high-speed PCBs, base station equipment, taking antenna boards and power amplifier boards as examples, where a large number of high-frequency PCBs are used to process radio frequency. Other PCBs are designed at power supply, microwave communication etc.
Aluminum PCB also named as metal clad (MCPCB) PCB, insulated metal substrate (IMS or IMPCB) PCB, thermally conductive PCBs, etc. It is generally including single layer, double layer and multi-layer. Aluminum PCBs is the most common type - the base material consists of aluminum core with standard FR4. Aluminum PCBs is regarded as the solution to high power and tight tolerance applications.
• Environmentally Friendly: Aluminum is non-toxic and recyclable. Manufacturing with aluminum is also conducive to conserving energy due to its ease of assembly.
• Heat dissipation: High temperatures can cause severe damage to electronics; Aluminum can actually transfer heat away from vital components, thus minimizing the harmful effect it could have on the circuit board.
• Higher durability: Aluminum provides strength and durability to a product that ceramic or fiberglass bases cannot.
• Lightweight: Aluminum is a surprisingly lightweight metal. Aluminum adds strength and resilience without adding on any additional weight.
Check Eashub's capability on Aluminum PCB for Telecom at below table:
Check Eashub's capability on Thick Copper PCB for Telecom at below table:
• Adapted permittivity.
• Low attenuation for efficient signal transmission.
• Homogeneous construction with low tolerances in insulation thickness and dielectric constant.
Check Eashub’s capability of High Frequency PCB used on Telecom at below table:
• Easier to place SMD components and more component space
• Faster routing
• More stable power
• Reduce interference inductance and capacitance effects
• Improve signal integrity in high-speed design
Check Eashub’s capability on HDI PCB for Telecom at below table:
Rigid-flex PCB circuit is a hybrid construction flex circuit combining rigid and flexible substrates which are laminated together under a single structure. Each layer of rigid-flex circuit are electrically interconnected by plated through holes (PTH), which is different from a flexible circuit with FR4/PI stiffener on top or bottom of flex circuit only by the means of preventive or thermal sensitive adhesive only, no PTH. Rigid-flex board own the advantages both rigid FR4 PCBs and flexible PCBs. In rigid area, components will be soldered on, and whole board can be bendable at the flexible circuit area. as these boards are designed in a 3D space, which also offers greater spatial efficiency. Benefits of Rigid-Flex PCBs are below:
• Save space and weight by applying 3D and remove connectors
• Assure higher reliability with fewer solder joints
• Simplified assembly and test processes.
• Provide simple modular interfaces to the system environment.
• Adapt to more complexity of mechanical designs
Check Eashub’s capability on Rigid-Flex PCB for Telecom as below table:
Check Eashub's capability on High Tg PCB for Telecom at below table:
| PCB Category | Multilayers | Backplane | High Frequency | Aluminum | Thick Copper | High Tg | HDI | Flexibile | Rigid-Flex |
| Consumer Electronics | x | x | x | x | x | x | x | x |
Aluminum PCB also named as metal clad (MCPCB) PCB, insulated metal substrate (IMS or IMPCB) PCB, thermally conductive PCBs, etc. It is generally including single layer, double layer and multi-layer. Aluminum PCBs is the most common type - the base material consists of aluminum core with standard FR4. Aluminum PCBs is regarded as the solution to high power and tight tolerance applications.
• Environmentally Friendly: Aluminum is non-toxic and recyclable. Manufacturing with aluminum is also conducive to conserving energy due to its ease of assembly.
• Heat dissipation: High temperatures can cause severe damage to electronics; Aluminum can actually transfer heat away from vital components, thus minimizing the harmful effect it could have on the circuit board.
• Higher durability: Aluminum provides strength and durability to a product that ceramic or fiberglass bases cannot.
• Lightweight: Aluminum is a surprisingly lightweight metal. Aluminum adds strength and resilience without adding on any additional weight.
Check Eashub's capability on Aluminum PCB for Telecom at below table:
| Feature | Capability |
| Quality Grade | Standard IPC 2 |
| Number of Layers | 4 - 24layers |
| Material | Aluminum core (Domestic 1060), Copper core, FR4 covering |
| Max Board Size | Max 450mm x 600mm |
| Final Board Thickness | 0.4mm - 5.0mm |
| Copper Thickness | 0.5oz - 10.0oz |
| Min Tracing/Spacing | 4mil/4mil |
| Min Drilling Hole Diameter | 6mil |
| Solder Mask Color | Green, Red, Yellow, Blue, White, Black, Purple, Matte Black, Matte green |
| Silkscreen Color | White, Black |
| Surface Treatment | Immersion gold, OSP, Hard Gold, Immersion Sliver, Enepig |
| Testing | Fly Probe Testing (Free) and A.O.I. testing |
| Impedance tolerance | ±10% |
| Lead Time | 2 - 28days |
Request for Aluminum PCB Quote
Thick copper PCB is characterized by structures with copper thicknesses from 105 to 400 µm. These PCBs are used for high current outputs and optimization of thermal management. The thick copper allows large PCB-cross-sections for high current loads and encourages heat dissipation. The most common designs are multilayer or double-sided. With this PCB technology it is also possible to combine fine layout structures on the outer layers and thick copper layers in the inner layers. Thick copper PCB has the best elongation performance and can be used in hot melt welding methods such as oxygen blowing at a high melting point and not brittle at low temperatures. Even in extremely corrosive atmospheric environments, copper PCB forms a strong, non-toxic passivation protective layer. The application of thick copper PCB makes the core component of electronic equipment products-circuit boards have a longer service life, and at the same time it is very helpful to the size reduction of electronic equipment.Check Eashub's capability on Thick Copper PCB for Telecom at below table:
| Feature | Capability |
| Quality Grade | Standard IPC 2 |
| Number of Layers | 4 - 30layers |
| Material | FR-4 Standard Tg 140°C, FR4-High Tg 170°C |
| Max Board Size | Max 450mm x 600mm |
| Final Board Thickness | 0.6mm - 6.5mm |
| Max Outer Layer Copper Weight | 15oz |
| Max Inner Layer Copper Weight | 12oz |
| Min. Track/Spacing-External | 4oz Cu 9mil/9mil,5oz Cu 11mil/11mil,6oz Cu 13mil/13mil,12oz Cu 20mil/32mil,15oz Cu 32mil/40mil |
| Min. Track/Spacing-Internal | 4oz Cu 8mil/12mil,5oz Cu 10mil/14mil,6oz Cu 12mil/16mil,12oz Cu 20mil/32mil |
| Min. Hole Size | 10mil |
| Solder Mask Color | Green, Red, Yellow, Blue, White, Black, Purple, Matte Black, Matte green |
| Silkscreen Color | White, Black |
| Surface Treatment | HASL lead free, Immersion gold, OSP, Hard Gold, Immersion Silver, Enepig |
| Testing | Fly Probe Testing (Free) and A.O.I. testing |
| Lead Time | 2 - 28days |
Request for Thick Copper PCB Quote
High-frequency PCB offers a frequency range of 500MHz - 2GHz, making it ideally suited for high-speed designs, as well as radio frequency (RF), microwave and mobile applications Teflon, FR4 or PPO were common material of high frequency PCB, Teflon is widely used in application normally above 5GHz with high performance. FR4 and PPO substrate are be used to the product frequency among 1GHz~10GHz with lower cost. High frequency PCB make a difference in PCB design by owning below feathers.• Adapted permittivity.
• Low attenuation for efficient signal transmission.
• Homogeneous construction with low tolerances in insulation thickness and dielectric constant.
Check Eashub’s capability of High Frequency PCB used on Telecom at below table:
| Feature | Capability |
| Quality Grade | Standard IPC 2 |
| Number of Layers | 2 - 24layers |
| Material | RO4003C, RO4350B, Ro3003, Ro3010, RT5880 |
| Max Board Size | Max 450mm x 600mm |
| Final Board Thickness | 0.4mm - 5.0mm |
| Copper Thickness | 0.5oz - 2.0oz |
| Min Tracing/Spacing | 2mil/2mil |
| Min Drilling Hole Diameter | 6mil |
| Solder Mask Color | Green, Red, Yellow, Blue, White, Black, Purple, Matte Black, Matte green |
| Silkscreen Color | White, Black |
| Surface Treatment | Immersion gold, OSP, Hard Gold, Immersion Silver, Enepig |
| Testing | Fly Probe Testing (Free) and A.O.I. testing |
| Impedance tolerance | ±10% |
| Lead Time | 2 - 28days |
Request for High Frequency PCB Quote
HDI (High density interconnect) PCB defined as a printed circuit board with a higher wiring density per unit area than traditional PCB. HDI includes the use of fine features or signal traces and spaces of 0.003” (75 µm) or less and laser-drilled blind or buried microvia technology. Using HDI technology is a significant increase in packaging density. The space obtained by finer track structures is available for components. Besides, overall space requirements are reduced will result in smaller board sizes and fewer layers. Usually FPGA or BGA are available with 1mm or less spacing. HDI technology makes routing and connection easy, especially when routing between pins. Below functions can be improved significant by HDI PCB:• Easier to place SMD components and more component space
• Faster routing
• More stable power
• Reduce interference inductance and capacitance effects
• Improve signal integrity in high-speed design
Check Eashub’s capability on HDI PCB for Telecom at below table:
| Feature | Capability |
| Quality Grade | Standard IPC 2, IPC 3 |
| Number of Layers | 4 - 30layers |
| Material | FR4 standard Tg 140°C,FR4 High Tg 170°C, FR4 and Rogers combined lamination, special materials |
| Max Board Size | Max 450mm x 600mm |
| Final Board Thickness | 0.4mm - 6.0mm |
| Copper Thickness | 0.5oz - 13oz |
| Min Tracing/Spacing | 2mil/2mil |
| Min Hole Diameter - Mechanical | 4mil |
| Min Hole Diameter - Laser | 3mil |
| Solder Mask Color | Green, Red, Yellow, Blue, White, Black, Purple, Matte Black, Matte green |
| Silkscreen Color | White, Black, Yellow, Blue |
| Surface Treatment | Immersion gold, OSP, Hard gold, Immersion Silver |
| Impedance control | ±10% |
| Lead Time | 2 - 28days |
• Save space and weight by applying 3D and remove connectors
• Assure higher reliability with fewer solder joints
• Simplified assembly and test processes.
• Provide simple modular interfaces to the system environment.
• Adapt to more complexity of mechanical designs
Check Eashub’s capability on Rigid-Flex PCB for Telecom as below table:
| Feature | Capability |
| Quality Grade | Standard IPC 2 |
| Number of Layers | 2 - 24layers |
| Material | FR4/PTFE/R-F |
| Max Board Size | Max 450mm x 540mm |
| Final Board Thickness | 0.25mm - 5.0mm |
| Copper Thickness | 0.5oz - 2.0oz |
| Min Tracing/Spacing | 3mil/3mil |
| Min Hole Diameter - Mechanical | 6mil |
| Min Hole Diameter - laser | 3mil |
| Solder Mask Color | Green, Red, Yellow, Blue, White, Black, Purple, Matte Black, Matte green |
| Silkscreen Color | White, Black, Yellow |
| Surface Treatment | HASL, Hard Gold Finger, OSP, Immersion Gold, Immersion Tin, Immersion Sliver |
| Impedance control | ±10% |
| Lead Time | 2 - 28days |
Request for Rigid-Flex PCB Quote
High Tg PCB: Circuit board material must flame-resistant, it can’t be burned at a certain temperature and only be softened. The temperature point is called the glass transition temperature (Tg). PCB made with Tg ≥ 170℃ material, which is called a high Tg printed circuit board. The Glass Transition Temperature (Tg) is one of the most important properties of any epoxy and is the temperature region where the polymer transitions from hard, glassy material to a soft, rubbery material. The higher Tg point means a higher temperature requirement during lamination. And the boards will be hard and crisp, which will affect the hole and the electrical properties. Common PCB materials at high temperatures, not only will be softened, deformation, melting and other phenomena, but also the mechanical and electrical properties decline sharply. General FR4 Tg is 130-140 centigrade, moderate Tg is greater than 150-160 centigrade, High-Tg is greater than 170 degrees. The higher of Tg, the better the performance of PCB heat resistance, moisture resistance, chemical resistance, stability and other characteristics. When the working temperature reaches the melting point, that means the temperature exceeds the Tg value, the status of PCB material will be changed from glassy to liquid, which will affect the function of PCB. And this value is related to the stability of the PCB dimension.Check Eashub's capability on High Tg PCB for Telecom at below table:
| Feature | Capability |
| Quality Grade | Standard IPC 2 |
| Number of Layers | 2 - 40layers |
| Material | Tg140 FR-4,Tg150 FR-4,Tg170 FR-4,Tg150 FR-4, Tg170 FR-4, IT180, Rogers 4350B |
| Max Board Size | Max 450mm x 900mm |
| Final Board Thickness | 0.2mm - 6.5mm |
| Copper Thickness | 0.5oz - 13oz |
| Min Tracing/Spacing | 2mil/2mil |
| Min Drilling Hole Diameter | 6mil |
| Solder Mask Color | Green, Red, Yellow, Blue, White, Black, Purple, Matte Black, Matte green |
| Silkscreen Color | White, Black |
| Surface Treatment | HASL lead free, Immersion gold, OSP, Hard Gold, Immersion Silver,Enepig |
| Testing | Fly Probe Testing (Free) and A.O.I. testing |
| Lead Time | 2 - 28days |
