Engineer Capability
Main Equipment
| Surface Mount (SMT) | Inspection | Rework/Others |
| Screen Printer (MPM, GKG) | 3D X-ray | Automatic Depanel / Router |
| Chip Mounter & IC Placer (Panasonic,Yamaha) | 3D AOI | BGA Rework Station |
| SPI AOI (Omron) | ICT (Teradyne, TRI, JET) | Varnishing/Conformal Coating |
| Reflow Oven (Heller, Ersa) | EDX for RoHS inspection | Cleanroom Class-100,000 |
| Solder Wave (JT) | First Article Inspection machine | Reliability -Climate Chamber |
General Manufacturing Porcess
Technical Capability
