26-layers Immersion Gold Board
Layers : 26L
Thickness : 6.6mm
Out Layer Copper Thickness : 2 OZ
Inner Layer Copper Thickness : 2 OZ
Min hole size :0.8mm
Min Line Width/Space : 3mil
Surface finish : Hard Gold
Application : IC testing instrument
Features : High complexity multilayer
Thickness : 6.6mm
Out Layer Copper Thickness : 2 OZ
Inner Layer Copper Thickness : 2 OZ
Min hole size :0.8mm
Min Line Width/Space : 3mil
Surface finish : Hard Gold
Application : IC testing instrument
Features : High complexity multilayer